SEIDL, Karsten

SEIDL, Karsten
Prof. Dr. Ing.


2004 – 2005     Research Scholar, NSF Engineering Research Center for Computer-Integrated Surgical Systems and Technology, The Johns Hopkins University, Baltimore, USA, Prof. Kazanzides / Prof. R. Taylor
2006 – 2011  Research Scientist, Microsystems Materials Laboratory, Department of Microsystems Engineering (IMTEK), Freiburg, Germany, Prof. O. Paul / cooperation with Prof. Th. Stieglitz
2012 – 2015    Research Engineer, Department of Microsystems Technology, Robert Bosch GmbH, Gerlingen, Germany, Dr. F. Lärmer
2015 – 2018   Project Manager / Product Manager, Bosch Healthcare Solutions (BHCS) GmbH, Waiblingen, Germany
2018 – present                   Head of Department “Micro- and Nanosystems”, Fraunhofer Institute for Microelectronic Circuits and Systems, Duisburg, Germany
2018 – present                                          W3 Professor for “Micro- and Nanosystems for Medical Technology”, University of Duisburg-Essen, Duisburg, Germany


Academic Qualification and Education

2007   Diploma in Electrical Engineering and Information Technology (Major in Biomedical Engineering and Medical Computer Science), Technical University of Ilmenau, Germany
2013 Doctor of Engineering, University of Freiburg, Germany
2018 W3 Professor at University Duisburg-Essen, Duisburg, Germany


Teaching Experience

  • Solid State Physics (Winter Semesters, 2006 – 2011), B.Sc. Level
  • Semiconductors (Sommer Semesters, 2006 – 2011), B.Sc. Level
  • Electrical Engineering (Sommer Semesters, 2007 – 2008), B.Sc. Level
  • Cleanroom Lab Class (Summer Semesters, 2008 – 2011), B.Sc. Level.
  • Introduction to Multi-Physics Simulation (Summer Semesters, since 2018), B.Sc.Level
  • Active electrical implants  (Winter Semesters, since 2018), M.Sc. Level


Honors, Awards, Scholarships and Other Appointments (Selection)

05/2000  Jugend forscht (German, nationwide program for nationwide program for promotion of young researchers), 2nd prize Saxony State Competition; Fraunhofer Gesellschaft Award; Saxony State Ministry for Economic Affairs and Labor Award
2004 - 2006                  German National Academic Foundation,  National scholarship
2010  IEEE BioCAS 2010, Co-author of Best Paper Award
2011    Student Paper Competition Award – Third Place at IEEE Sensors 2012
2013 IEEE MEMS 2013 Outstanding Paper Award
2013 Hojjat Adeli Award for Outstanding Contributions in Neural Systems
2014     Klee-Award of DGBMT for promoting young academic talents
2018 reddot Award and iF Award
2018   Bosch Innovation Award


Research Topics

(Bio-)MEMS/NEMS, CMOS-based sensor technologies, biosignal processing, lab-on-a-chip systems; miniaturized, wireless pressure sensors for medical implants, highly-sensitive optical and electrical biomedical nanosensors; neural interfacing technologies

Key Publications / Patents

  1. S. Herwik, S. Kisban, A.A.A. Aarts, K. Seidl, G. Girardeau, K. Benchenane, M.B. Zugaro, S.I. Wiener, O. Paul, H.P. Neves, P. Ruther. Fabrication technology for silicon based microprobe arrays used in acute and sub-chronic neural recording. J. of Micromech. and Microeng., 2009, vol. 19, p. 074008(11pp).
  2. K. Seidl, S. Spieth, S. Herwik, J. Steigert, R. Zengerle, O. Paul, P. Ruther. In-plane silicon probes for simultaneous neural recording. J. of Microm. and Microeng., vol. 20, no. 10, 105006(11p), 2010.
  3. P. Ruther, S. Herwik, S. Kisban, K. Seidl, O. Paul. Recent progess in neural probes using silicon MEMS Technology, IEEJ Trans. Electr. And Electronic Eng., vol. 5, pp. 505-15, 2010.
  4. K. Seidl, T. Torfs, P.A. De Mazière, G. Van Dijck, R. Csercsa, B. Dombovari, Y. Nurcahyo, H. Ramirez, M.M. Van Hulle, G.A. Orban, O. Paul, I. Ulbert, H. Neves, P. Ruther. Control and data acquisition software for microprobe arrays with electronic depth control. Biomed. Tech. (Special Issue Neuromath), vol. 55, pp. 183-191, 2010.
  5. K. Seidl, S. Herwik, T. Torfs, H. Neves, O. Paul, and P. Ruther, “CMOS-based high-density silicon microprobe array for electronic depth control in intracortical neural recording,” J. Microelectromech. Syst., vol. 20, no. 6, pp. 1439-48, 2011.
  6. G. V. Dijck, K. Seidl, O. Paul, P. Ruther, M. M. V. Hulle, and R. Maex, “Enhancing the yield of high-density electrode arrays through automated electrode selection,” Int. J. Neural Systems, vol. 22, no.1, pp. 1-19, 2012.
  7. K. Seidl, M. Schwaerzle, I. Ulbert, H. Neves, O. Paul, and P. Ruther, “CMOS-based high-density silicon microprobe array for electronic depth control in intracortical neural recording—characterization and application,” J. Microelectromech. Syst., vol. 21, no. 6, pp. 1426-35, 2012.
  8. T. Torfs, A. Aarts, M. Erismis, J. Aslam, R. Yazicioglu, K. Seidl, S. Herwik, I. Ulbert, B. Dombovari, R. Fiath, B. P. Kerekes, R. Puers, P. Ruther, C. V. Hoof, and H. Neves, “Two-dimensional multi-channel neural probes with electronic depth control,” IEEE Trans. Biomed. Circuits Syst., vol. 5, no. 5, pp. 198-201, 2011.
  9. M. Schwaerzle, K. Seidl, U. Schwarz, O. Paul and P. Ruther, "Ultracompact optotrode with integrated laser diode chips and SU-8 waveguides for optogenetic applications," Tech. Digest IEEE MEMS Conf. 2013 (Taipei, Taiwan), pp. 1029–32, 2013.
  10. B. Faltin, J. Rupp, J. Steigert, Ch. Dorrer, K. Seidl, “Microfluidic Device and Method for Analysing Samples”, US Patent App. 16/348,673, 2019.